Insert and Edge filling of honeycomb structures
CORFIL® potting compounds are designed for insert and edge filling of honeycomb structures. Some are also suitable for use as synthetic core splice adhesives. CORFIL® products can be used in co-cure and co-bond applications. CORFIL® potting compounds:
- Support low viscosity formulations suitable for use with automated dispensing equipment and small-cell-sized honeycomb core
- Reduce slump and resin separation from thixotropic formulations eliminating the need for molds or other containment devices during cure
- Offer epoxy prepregs compatible with 250°F and 350°F curing, as well as formulations compatible with high-temperature BMI prepregs post-cured to 450°F.