Sifren® 46 (C4F6 or Hexafluorobutadiene) C4F6 has a GWP=0 and it is the most advanced etching gas for critical applications. Its low C/F ratio and its insaturations allow achieving the highest aspect ratios in etching. Sifren® 46 (C4F6 or Hexafluoro-1,3-butadiene) is an unsaturated fluorocarbon with an alternating double bond. It is a colorless, odorless, toxic, flammable gas showing very high performance for plasma, ion beam, or sputter etching in semiconductor devices manufacturing with Xenon (Xe) and Argon (Ar) as carrier or dilution gas. Due to the short atmospheric lifetime (< 1day), the negligible global warming potential, and the inertness to the stratospheric ozone layer, Sifren® 46 is an environmentally compatible gas.
- Asia / Pacific
- Europe / Middle East / Africa
- North America
- Latin America