A low viscosity one part epoxy potting compound designed for use in insert or edge filling of honeycomb structure Type: potting compound | Temp: service temp < 320F | Process: autoclave | Proc Temp: 250 (121) | Serv Temp: 250 (121) | Density: 43.7 (0.7) | RT Comp: 6322 (43.6)

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    BR®

Markets

Segments Applications
Airframe Secondary structural materials
Segments Applications
Public Transportation Interiors

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for BR 623P4