BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 – 350°F (-57 – 177°C). 
BR® 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material.
Features & Benefits•     Structural properties from -67°F to 400°F (-55°C to 204°C) •     Compatibility with most 350°F (177°C) service temperature adhesives•     Protects prepared surfaces from further oxidation•     Improves hydrolytic stability at the adhesive-to-metal interface SUGGESTED APPLICATIONS•     Insert and edge filling of honeycomb structures


  • Global Business Unit
    Composite Materials
  • Brand


Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for BR 624 POTTING COMPOUND 1'S