Solvay's CERIUM OXIDE HSA 8 is used for Chemical Mechanical Planarization (CMP) for the manufacture of semi-conductors.

CMP is a process to planarize the relief on the surface of silicon oxide, polysilicon an metal layers. It is used to planarize these layers  in order to prepare them for the lithographic steps .
CMP uses chemicals that react with the surface of the substrate, thus transforming it (Chemical), abrasive particles remove the layer of chemically transformed material (Mechanical). With this chemical transformation, the  planarization process is simunalteoulsy accelerated and improved, compared to simple mechanical polishing.


  • CAS number
  • Global Business Unit
    Special Chem
  • Synonyms


Segments Applications
Enhanced Design & Connectivity Electrical Components
Process Efficiency Fab Process Material

Chemical categories

Chemical category Chemical family Chemical product
Rare Earths and Metal compounds Rare Earth Oxide Cerium oxide

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for CERIUM OXIDE HSA 8