250°F (121°C) cure film adhesive and surfacing filmType: film, surfacing film | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 250 (121) | RT Lap: 4850 (33.5) | Elev Lap: 5150 (35.5) at 180°F (82°C) | RT Peel: 21 (MTM), 21 (HCSP) | TG: - | Flow: 400 - 450 | Flat Tens: 892 (6.15) | Lightning: Y

Markets

Segments Applications

Processing Method

  • Autoclave
  • Vacuum Bag Only

Chemical categories

Chemical category Chemical family Chemical product
Composite materials Thermoset composite Epoxy

Product Functions

  • Medium Service Temperature (70°C to 150°C)

Format

Physical form
Adhesives

Region of availability

  • Africa & Middle East
  • Asia Pacific
  • Europe
  • Latin America
  • North America

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