350 °F (177 °C) cure high performance adhesive film Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave, out of autoclave | Proc Temp: 350 (177) | RT Lap: 4415 (30.5) | Elev Lap: 3930 (27.1) at 250°F (121°C) | RT Peel: 30 (MTM), 25 (HCSP) | TG: 342 (172) | Flow: 400 - 450 | Flat Tens: 925 (6.38)

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    FM®

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for FM 309-1