350°F(177°C) cure toughened epoxy film adhesive Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 350 (177) | RT Lap: 3500 (24.13) | Elev Lap: 1970 (13.6) at 350°F (177°C) | RT Peel: 16 (MTM), 60 (HCSP) | TG: - | Flow: - | Flat Tens: 1210 (8.34)

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    FM®

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for FM 377