FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures. FM® 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications. Type: film | Temp: 320F 500F | Process: autoclave | Proc Temp: 350 (177) cure, 550 (288) post-cure | RT Lap: 3600 (24.8) | Elev Lap: 3100 (21.4) at 350°F (177 °C) | RT Peel: 22 (HCSP) | TG: - | Flow: - | Flat Tens: 890 (6.14)

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    FM®

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Polyimide

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for FM 57