250°F (121°C) cure toughened general purpose epoxy film adhesive Type: film | Temp: service temp < 320F | Process: autoclave | Proc Temp: 250 (121) | RT Lap: 6680 (46.1) | Elev Lap: 4400 (30.4) at 180°F (82°C) | RT Peel: 87 (MTM), 95 (HCSP) | TG: 169 (76) | Flow: 325 - 350 | Flat Tens: 1300 (8.96)

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    FM®

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Europe / Middle East / Africa
  • North America

Download documentation for FM 73