FusePly

FusePly is a new game-changing materials technology designed to achieve covalent chemical bonding in adhesive joints of pre-cured composite structures using either conventional co-bonding or secondary bonding processes. Through patented technology, FusePly is able to bring a new level of reliability to the bonding process by creating a chemically-active surface for bonding, rather than just a mechanically-prepared surface as with traditional peel plies, sanding, or plasma surface treatment. The result is structural performance and dependability of co-cured bonded structures with the convenience and flexibility from using pre-cured composites.

FusePly was designed to be processed and handled just like conventional peel ply surface preparations, allowing for seamless insertion of the technology into a manufacturing shop. The system, supplied in film form with a polyester peel ply fabric, is engineered to offer a clean, fiber-free surface for composite bonding applications. It is compatible with most commercial 350°F cure epoxy-based prepregs and adhesive systems and requires no additional processing steps, such as sanding or solvent wiping prior to bonding.

Features and Benefits 

• Chemically-bonded interface creates unitized structures 
• Handling and processing is similar to conventional peel ply films 
• Compatible with most 350°F epoxy-based commercial prepregs and adhesives 
• Minimizes the number of processing steps and reduces assembly time 
• Contamination-free surface, with no residual fibers, provides ideal surface for bonding 
• Superior reliability and bond performance for composite structures versus conventional surface treatment options 
• Outperforms traditional surface preparation methods including plasma surface treatment 
• Provides 100% cohesive failure 
• Easy removal of peel ply fabric following cure 
• Suitable for co-bonding and secondary bonding of composite parts