HT® 424 is an aluminum filled modified epoxy phenolic resin coated on a glass carrier. It was developed for bonding metal-to-metal and sandwich composite structures requiring long-term exposure to 300˚F (149˚C) and short-term exposure to 500˚F (260˚C). HT® 424 has an adaptable bonding procedure with cure temperatures ranging from 12 hours at 230˚F (110˚C) to 40 minutes at 340˚F (171˚C) that can be used without sacrificing physical properties.
HT® 424 adhesive film may be used with or without a primer. The film-primer system offers the advantage of protecting the clean metal prior to final assembly. Features and Benefits
  • Used in metal-to-metal bonding and sandwich composite structures
  • Long-term exposure to 300˚F (149˚C); short-term exposure to 500˚F (260˚C)
  • Can be used with or without primer 
  • Wide variations in bonding temperatures: 12 hours at 230˚F (110˚C) to 40 minutes at 340˚F (171˚C)


  • Global Business Unit
    Composite Materials
  • Synonyms
    ht424; ht 424; 424; ht


Segments Applications
Lightweighting Structural & Semi-Structural Parts
Segments Applications
Airframe Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy
Composites Thermoset Phenolic

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for HT® 424