METLBOND® 2555 is a 350°F (177°C) cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and low loss tangent electrical properties. Typical applications include honeycomb sandwich construction, metal-to-metal bonding, metal-to-composite bonding, composite-to-composite bonding, and 350°F (177°C) cure satellite structure applications. Other products in this cyanate ester family include CYCOM® 5575-3 Glass and Quartz Prepregs, FM® 2525 Adhesive, FM® 6555-1 and BR® 6565 Syntactic Foams. Features and Benefits: Low dielectric constant and loss tangent for radome application Suitable for bonding both metals and composites; co-cure with most 350°F (177°C) cure prepregs Low out-gassing and low moisture absorption Service temperature up to 450°F (232°C) with post cure

Identity

  • Global Business Unit
    Composite Materials

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Cyanate ester

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for Metlbond 2555