SolvaLiteTM 750 is a two part epoxy resin system developed specifically for the high rate manufacture of components using a High Pressure Resin Transfer Moulding (HP-RTM) process. With HP-RTM moulding equipment, SolvaLiteTM 750 is able to achieve three minute cure times. High Tg which exceeds typical curing temperatures making it ideally suited to hot-demoulding. 135°C Tg (DMA E’ onset).
Global Business UnitComposite Materials
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Region of commercial availability
- Asia / Pacific
- Europe / Middle East / Africa
- North America
- Latin America