SolvaLiteTM 750 is a two part epoxy resin system developed specifically for the high rate manufacture of components using a High Pressure Resin Transfer Moulding (HP-RTM) process. With HP-RTM moulding equipment, SolvaLiteTM 750 is able to achieve three minute cure times. High Tg which exceeds typical curing temperatures making it ideally suited to hot-demoulding. 135°C Tg (DMA E’ onset).

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    SOLVALITE®

Markets

Segments Applications
Lightweighting Structural & Semi-Structural Parts

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for SolvaLite 750