FM® 1000 is a modified polyamide-epoxy unsupported adhesive film and is especially developed for bonding metals, structural plastic laminates and various composite structural plastic sandwiches. FM® 1000 film adhesive is serviceable over a temperature range of -423°F to 200°F (-250°C to 95°C).
Primers are not generally required for use with FM® 1000 adhesives to increase strength; however, two primers are available for use where processing requires “tacking” of the FM ® 1000 film in place or for protection of clean details. BR® 1009-8 tack primer is used for room temperature tacking while BR® 1009-49 tack primer is used for “heat-tacking” at 175°F (80°C)
FM® 1000 film adhesive, with and without primer, has been tested extensively against the requirements of Federal Specification MMM-A-132. FM® 1000 has a typical cure cycle of 60 minutes at 340° +/- 10°F (170°C +/- 6°C) at 40 psi (0.28 MPa).
Typical applications for FM® 1000 include metal-to-metal bonding, composite-to-composite bonding, and composite structural plastic sandwich bonding.
 Features and Benefits  

• Exceptional lap shear and peel strength 
• Wide service temperature range; -423°F to 200°F    (-250°C to 95°C) 
• Designed for use in metal-to-metal and honeycomb sandwich structures 
• Qualified to MMM-A-132, Type 1, Class 1   

FM 16771 is a glass roving, high impact material impregnated with a one-step phenolic resin. Physical properties will vary with molding techniques and fiber orientation. Process: Compression Mold | Type: Glass/Phenolic

Epoxy-based co-curable surfacing film for composites cured at 250°F (121°C) or 350°F (177°C). The product is supplied on a non-woven fabric carrier at nominal weights of 0.035 lb/ft2 (171 g/m2) and 0.080 lb/ft2 (392 g/m2). Provides high quality smooth surface requiring minimum preparation for painting. 30 days outlife at 21°C (70°F) Type: surfacing film | Out Time (days): 30 | Cure Flex: 248 - 347 | (125 - 175) | Process: autoclave

FM® 209-1

FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear strength up to 250˚F (121˚C).

FM® 209-1 is designed for bonding metallic and composite substrates in monolithic and sandwich structures. It is compatible with most 250˚F (121˚C) and 350˚F (177˚C) curing epoxy-based prepreg systems for co-cure, co-bond and secondary bonding. FM® 209-1 adhesive film provides minimum shop life of 30 days at 75˚F (24˚C). FM® 209-1 adhesive has excellent resistance to both pre-bond and post- bond humidity exposures.

FM® 209-1 adhesive is supplied at various weights and thicknesses. It is featured as an unsupported film or as a supported film with woven, knit or mat carrier.

FM® 209-1 film adhesive can be cured within the temperature range of 160˚F to 350˚F (71˚C to 177˚C) under vacuum-only pressure. The standard cure cycle for FM® 209-1 is 250˚F (121˚C) for 90 minutes under full vacuum for out-of-autoclave (OOA) bonding applications or under 40 psi (0.28 MPa) pressure for autoclave cures.
Typical applications for FM® 209-1 include out-of-autoclave bonding of metal & composite monolithic/sandwich structures, low temperature cure applications, and low temperature good serviceability applications.

Features and Benefits
- 250˚F (121˚C) curing high performance metal and composite bonding film 
- Designed for out-of-autoclave bonding of metal and composite monolithic and sandwich structures 
- Builds sufficient green strength at 160˚F (71˚C) when co-cured with CYCOM® 5320-1 out-of-autoclave epoxy prepreg 
- Excellent combination of high peel and shear properties from -65˚F to 250˚F (-54˚C to 121˚C) 
- Excellent resistance to both pre-bond and post-bond humidity 
- Service temperature of 250˚F (121˚C) 
- Shop life of 30 days or more at 75˚F (24˚C) 
- Dual curing capability; 250˚F (121˚C) and 350˚F (177˚C) 
- Compatible with various solvent- and water- based bond primers 
- Capable of low temperature curing, x ≤ 250˚F (121˚C) 
- Recommended use with CYCOM® 5320-1, CYCOM® 977-2, and other epoxy prepregs

350°F (177°C) cure modified epoxy film adhesive Type: film, surfacing film | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 350 (177) | RT Lap: 4325 (29.8) | Elev Lap: 3360 (23.2) at 250°F(121°C) | RT Peel: 26 (MTM), 11(HCSP) | TG: 229 (109) | Flow: 200 - 225 | Flat Tens: 750 (2.17) | Lightning: Y

250°F (121°C) cure film adhesive and surfacing film Type: film, surfacing film | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 250 (121) | RT Lap: 4850 (33.5) | Elev Lap: 5150 (35.5) at 180°F (82°C) | RT Peel: 21 (MTM), 21 (HCSP) | TG: - | Flow: 400 - 450 | Flat Tens: 892 (6.15) | Lightning: Y

350 °F (177 °C) cure high performance adhesive film Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave, out of autoclave | Proc Temp: 350 (177) | RT Lap: 4415 (30.5) | Elev Lap: 3930 (27.1) at 250°F (121°C) | RT Peel: 30 (MTM), 25 (HCSP) | TG: 342 (172) | Flow: 400 - 450 | Flat Tens: 925 (6.38)

FM® 3500 EZP

FM® 3500 EZP is a resin impregnated glass or polyester fabric peel ply. The resin formulation and fabric construction of FM® 3500 EZP have been optimized to provide a fiber-free and resin-rich prepreg surface for co-bonding and secondary bonding applications. FM® 3500 EZP is compatible with most 350⁰F (177⁰C) curing prepregs and adhesives. It maximizes adhesive bond strength when used with the latest generation of high performance prepregs and adhesives.

Features and Benefits
- Provides consistent and reproducible resin-rich surface for bonding
- Protects composite surface from contamination prior to final assembly
- Easy one-piece removal even after curing
- Compatible with most 350°F (177°C) curing prepregs and adhesives
- Exhibits excellent tack and drape
- Exhibits a 30-day shop life

350°F (177°C) cure modified epoxy adhesive Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 350 (177) | RT Lap: 3100 (21.4) | Elev Lap: 3600 (24.8) at 250°F (121°C) | RT Peel: 27 (HCSP) | TG: - | Flow: 625 - 675 | Flat Tens: 1000 (6.89)

350°F(177°C) cure toughened epoxy film adhesive Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 350 (177) | RT Lap: 3500 (24.13) | Elev Lap: 1970 (13.6) at 350°F (177°C) | RT Peel: 16 (MTM), 60 (HCSP) | TG: - | Flow: - | Flat Tens: 1210 (8.34)

FM® 385 - adhesive film was developed specifically for bonding composite and metallic structures for nacelle applications. It provides a unique combination of high Tg, toughness, and flatwise tensile properties.
FM® 385 is compatible with most 350°F (177°C) curing epoxy-based prepreg systems. It has excellent resistance to pre-bond and post-bond humidity and has a dry service temperature of 420°F (216°C).
FM® 385 adhesive film provides excellent handling properties (good tack and drape) and has a minimum shop life of 30 days at 75°F (24°C).

FM® 385 adhesive can be supplied as a supported (woven glass or mat carrier) or unsupported film at various weights and thicknesses. For co-cure or co-bond applications, adhesive film weight of 0.060 lb/ft2 – 0.080 lb/ft2 (293 gsm – 391 gsm) with woven glass or a glass mat carrier is recommended. This adhesive film is suitable for bonding of monolithic or sandwich structures. Honeycomb sandwich panels manufactured using FM® 385 adhesive film demonstrate excellent laminate quality (void content <1%) and very good filleting.

FM® 385 adhesive film can be cured at 350°F (177°C) in 90 minutes at 40 psi (0.28 MPa) or can be cured under vacuum-only pressure. Mechanical performance of vacuum-only cure is comparable to autoclave pressure cure.

Solvay recommends using BR® 6750 (chromated) or BR® 6700 (non-chromated) water-based primers for metal bond applications using FM® 385 adhesive film. For higher temperature applications or continuous service at 350°F (177°C), higher Tg BR® 6800 (non-chromated) water-based primer is recommended.

Typical applications for FM® 385 include co-cure, co-bond and secondary bonding of metallic and composite structures for nacelle applications. Additional applications include honeycomb sandwich structures.

Features and Benefits 

• Excellent fracture toughness (co-cure, co-bond or secondary bond) 
• Service temperature of 420°F (216°C) dry and 300°F (149°C) wet 
• Excellent resistance to both pre-bond and post-bond humidity 
• Good combination of peel and shear properties 
• Tg > 375°F (191°C) 
• Designed for bonding composite sandwich structures (good filleting properties) 
• Unsupported film designed for reticulation for acoustic structures 
• Highly flow controlled, good tack and handling properties 
• Shop life > 30 days at 75°F (24°C) 
• Compatible with most 350°F (177°C) curing epoxy prepregs

FM® 400NA is a non-asbestos version of FM® 400 and is designed to provide similar performance to that of FM® 400 adhesive across the board. It is supplied with a lightweight nylon carrier and is designed for bonding metal-to-metal and sandwich composite structures requiring long time exposures to 420°F (216°C).

BR® 400 is a modified epoxy corrosion inhibiting primer and provides excellent corrosive resistance when used on aluminum structures. FM® 400NA adhesive film will also bond to BR® 127 primer with normal results. Where corrosion resistance is not required, FM® 400NA adhesive film can be used without primer.

FM® 400NA adhesive film can be cured over a wide range of heat up rates, temperatures, and pressures. The recommended cure cycle is a 3°F/min to 8.5°F/min (1.6°C/min to 4.7°C/min) heat up rate to 350°F (177°C) with a 60 minute hold and 45 psi (0.31 MPa) pressure.

Typical application for FM® 400NA include bonding of honeycomb sandwich structures, as well as metal-to-metal bonding applications.

Features and Benefits :
• Designed to bond metal-to-metal and honeycomb sandwich structures
• Long term thermal resistance at 420°F(216°C)
• Can be cured with a wide range of heat-up rates
• Structural performance from -67°F(-55°C) to 420°F(216°C)
• Does not contain asbestos

A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressure Type: core splice foam | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 225 - 350 (107 - 177) | Serv Temp: 350 (177) | Expan Ratio: 1.7X - 3.5X

High performance BMI adhesive film for both composite and metallic structures Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 375 (191) cure, 440 (227) post-cure | RT Lap: 3375 (23.0) | Elev Lap: 4200 (29.0) at 300°F (149°C) | RT Peel: 15 (HCSP) | TG: - | Flow: - | Flat Tens: 1280 (8.83)

A modified epoxy foam designed to minimize variation in cell structure Type: core splice foam | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 225 - 350 (107 - 177) | Serv Temp: 350 (177) | Expan Ratio: 1.5X - 3.5X

FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures. FM® 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications. Type: film | Temp: 320F 500F | Process: autoclave | Proc Temp: 350 (177) cure, 550 (288) post-cure | RT Lap: 3600 (24.8) | Elev Lap: 3100 (21.4) at 350°F (177 °C) | RT Peel: 22 (HCSP) | TG: - | Flow: - | Flat Tens: 890 (6.14)

FM® 6604-1 is a modified bismaleimide (BMI) resin core splice foaming adhesive. It has a cure temperature of 350°F (177°C) with a post cure at 440°F (227°C). The service temperature is -67°F to 450°F (-55°C to 232°C) with post-cure.

Typical applications for FM® 6604-1 include core shear-ties, edge closeouts, and insert bonding.

Features and Benefits 

• Maximum continuous service temperature up to 450⁰F (232⁰C) with post cure. 
• Expansion ratio 2:1 nominal. 
• Ideal for non-metallic core splice edge close out 
• Long-term aging 
• High strength-to-density ratio 
• Structural equivalency to unspliced core 
• Fuel tight

FM® 680 is an aluminum filled, condensation-type polyimide supported on a fiberglass cloth. It is suitable for bonding titanium, stainless steel and cured polyimide composites structures. FM 680 can also be used for co-cure applications with high temperature composite materials.
For priming prepared metal surface, BR® 680 adhesive primer is recommended.

FEATURES & BENEFITS (371°C) service temperature
350°F (177°C) processing with elevated post-cure
Superior thermal oxidative stability
Condensation-type polyimide
Co-curable with Avimid® N and other polyimide composite materials
Does not contain methylene dianiline (MDA)

SUGGESTED APPLICATIONS
Titanium bonding
Stainless steel bonding
Polyimide composite bonding