CYCOM®

CYCOM® 1908/T800-12K is a 300⁰F - 350⁰F (149⁰C - 177⁰C) curing epoxy resin with a wet service temperature of 180⁰F - 200⁰F (82⁰C - 93⁰C) and a dry service temperature of 250⁰F - 350⁰F (121⁰C - 177⁰C).
Typical applications for CYCOM® 1908/T800-12K include use in pressure vessels and motor cases.

Features and Benefits

• Capable of oven or autoclave cure 
• High flow resin system which is adjustable through an intermediate hold step
• Resin system allows for good fiber tensile translation 
• Low resin reactivity which manages exothermic reaction and allows this material to be used in manufacturing thick wall composites

Extremely tough medium temperature curing modified epoxy resin. To use where impact resistance and lightweight as well as versatile cure conditions are required. 14 days out life at 21°C (70°F). Very high impact resistance. 135°C (275°F) cure temperature. DMA E' onset Tg of 150°C (320°F) following 3 hour at 135°C (275°F) cure. Out Time (days): 14 | Temp: 248 (120) | Cure Flex: 275 - 302 (135 - 150) | Process: autoclave, press

Phenolic system available as a drapeable prepreg for fabrication of complex vacuum bag or autoclave cured parts or as a low tack prepreg for press cured parts. Type: Phenolic | Temp: Cure temperature 200-250 | Process: Press Cure-MOP, Oven Cure, Press Cure-Crushed Core | OSU Heat Release: Yes | Flamability: Yes | Smoke: Yes | Toxicity: Yes | Reinforcements: Glass, Carbon, Aramid | Core Adhesion Level: High

350°F to 400°F (177°C to 204°C) curing bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C). High-strain carbon fibers and improved damage-resistance. | 28 days outlife at 21°C (70°F) Product Form: BMI | Out Time (days): 28 | Temp: 482 (250) | Cure Flex: 356 - 446 (180 - 230) | Process: autoclave, press

A chopped glass fiber impregnated with a controlled-flow BMI resin for use in compression molding applications requiring high temperature service. Type: thermoset composite | Temp: service temp < 320F | Process: autoclave

Toughened epoxy resin system Type: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: high | OHC Wet: medium | TG Wet: 302 (150) | Proc Temp: 350 (177)

CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower temperature curing capability, it is also suitable for prototyping where low cost tooling or vacuum-bag-only curing is required. CYCOM® 5320-1 handles like standard prepreg, yet can be vacuum bag cured to produce autoclave quality parts having very low porosity. It offers mechanical properties equivalent to other 350°F (177°C) autoclave-cured toughened epoxy prepreg systems after a 350°F (177°C) freestanding postcure. Type: thermoset composite | Temp: service temp < 320F | Process: autoclave, out of autoclave | CAI KSI: medium | OHC Wet: high | TG Wet: 310 (154) | Proc Temp: 200 (93) or 250 (121) cure, 350 (177) post-cure

Modified epoxy resin specifically developed for out-of-autoclave processing (can also be pressed if required). Excellent mechanical properties generated at low cure temperatures (from 70°C (160°F)). 21 outlife at 21°C (70°F). Product Form: epoxy | Out Time (days): 21 | Temp: 266 (130) | Cure Flex: 160-255 (70-125) | Process: vacuum | TG: 198 (92)

Epoxy resin system Type: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 190 (88) | Proc Temp: 250 (121)

Epoxy resin system Type: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: medium | OHC Wet: low | TG Wet: 190 (88) | Proc Temp: 250 (121)

Epoxy resin infusion system Type: resin | Temp: service temp < 320F | Process: out of autoclave | CAI KSI: medium | OHC Wet: medium | TG Wet: 336 (169) | Proc Temp: 350 (177)

Epoxy resin system Type: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: medium | OHC Wet: medium | TG Wet: 275 (135) | Proc Temp: 350 (177)

Toughened epoxy resin system Type: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: high | OHC Wet: medium | TG Wet: 284 (140) | Proc Temp: 350 (177)

Ideally suited to aerospace applications CYCOM® 97714A resin is a 250°F (121°C) curing epoxy resin with good 200°F (93°C) dry and 160°F (71°C) wet service capability. CYCOM® 97714A is based on the same chemistry as CYCOM® 7714A. CYCOM® 97714A has improved flatwise tension strength when compared to similar materials with no detriment to other mechanical properties when autoclave processed. The prepreg can also be press molded and vacuum bag processed and is co-curable with a number of other resin systems, providing design flexibility with respect to the use of hybrid lay-ups. The standard cure is two hours at 250°F (121°C). No post cure is required for 160°F (71°C) wet service capability. CYCOM® 97714A is impregnated via solution techniques. Features and Benefits: 250°F (121°C) Cure Flame Retardant Laminate and sandwich panel usage Used as a self-adhesive system Meets NASA outgassing requirements Used as self adhesive system 200°F (93°C) dry service temperature 160°F (71°C) wet service temperature Autoclave press mold, or vacuum bag processed Shelf Life 6 months at 0°F (-18°C) Handling Life 10 days at 75°F (24°C) Co-cureable with CYCOM® 7701, CYCOM® 7714 and CYCOM® 7714A systems