CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower temperature curing capability, it is also suitable for prototyping where low cost tooling or vacuum-bag-only curing is required. CYCOM® 5320-1 handles like standard prepreg, yet can be vacuum bag cured to produce autoclave quality parts having very low porosity. It offers mechanical properties equivalent to other 350°F (177°C) autoclave-cured toughened epoxy prepreg systems after a 350°F (177°C) freestanding postcure. Type: thermoset composite | Temp: service temp < 320F | Process: autoclave, out of autoclave | CAI KSI: medium | OHC Wet: high | TG Wet: 310 (154) | Proc Temp: 200 (93) or 250 (121) cure, 350 (177) post-cure


  • Global Business Unit
    Composite Materials
  • Brand


Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for CYCOM 5320-1