High purity mixtures for cleaning etching tools
Fluorine/Nitrogen (F2/N2) mixtures offer an efficient and environmentally friendly solution for cleaning etching tools used in semiconductor production. These high-purity mixtures effectively remove SiO2 and Si3N4 residues deposited during the etching process. Unlike NF3, which has a high Global Warming Potential (GWP) of 17,900, F2/N2 mixtures have a GWP of zero, making them a more sustainable alternative. Additionally, they can replace other cleaning gases like CF4 and C2F6, further reducing environmental impact.
