FM 300
350°F (177°C) cure modified epoxy film adhesive
Type: film, surfacing film | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 350 (177) | RT Lap: 4325 (29.8) | Elev Lap: 3360 (23.2) at 250°F(121°C) | RT Peel: 26 (MTM), 11(HCSP) | TG: 229 (109) | Flow: 200 - 225 | Flat Tens: 750 (2.17) | Lightning: Y
Identity
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Global Business UnitComposite Materials
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BrandFM®
Markets
Segments | Applications |
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Airframe | Secondary structural materials | Primary structural materials |
Chemical categories
Chemical category | Chemical family | Chemical product |
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Composites | Thermoset | Epoxy |
Region of commercial availability
- Asia / Pacific
- Europe / Middle East / Africa
- North America
- Latin America