350°F (177°C) cure modified epoxy film adhesive Type: film, surfacing film | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 350 (177) | RT Lap: 4325 (29.8) | Elev Lap: 3360 (23.2) at 250°F(121°C) | RT Peel: 26 (MTM), 11(HCSP) | TG: 229 (109) | Flow: 200 - 225 | Flat Tens: 750 (2.17) | Lightning: Y

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    FM®

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for FM 300