350°F (177°C) cure modified epoxy adhesive Type: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 350 (177) | RT Lap: 3100 (21.4) | Elev Lap: 3600 (24.8) at 250°F (121°C) | RT Peel: 27 (HCSP) | TG: - | Flow: 625 - 675 | Flat Tens: 1000 (6.89)

Identity

  • Global Business Unit
    Composite Materials
  • Brand
    FM®

Markets

Segments Applications
Airframe Secondary structural materials | Primary structural materials

Chemical categories

Chemical category Chemical family Chemical product
Composites Thermoset Epoxy

Region of commercial availability

  • Asia / Pacific
  • Europe / Middle East / Africa
  • North America
  • Latin America

Download documentation for FM 355