A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressureType: core splice foam | Temp: service temp < 320F | Process: autoclave, out of autoclave | Proc Temp: 225 - 350 (107 - 177) | Serv Temp: 350 (177) | Expan Ratio: 1.7X - 3.5X

Markets

Segments Applications

Processing Method

  • Autoclave

Chemical categories

Chemical category Chemical family Chemical product
Composite materials Thermoset composite Epoxy

Product Functions

  • High Service Temperature (>150°C)

Format

Physical form
Adhesives

Region of availability

  • Africa & Middle East
  • Asia Pacific
  • Europe
  • Latin America
  • North America

Download documents forFM 410-1